RIM

Moldex3D/Solid-RIM module is a true 3D simulation tool to analyze the reactive injection molding process for thermoset materials. The typical applications include injection molding of unsaturated polyester, polyurethane, liquid silicon rubber, and Microchip encapsulation with epoxy molding compound etc.

Moldex3D/Solid-RIM helps users to investigate potential defects in part and runner designs to optimize cavity filling and curing. With best-in-class 3D technology, Moldex3D/Solid-RIM provides more accurate analysis results than ever. Moreover, Moldex3D/Solid-RIM links seamlessly with InPack, a pre- and post-processor dedicated for Microchip encapsulation, to calculate the paddle shift and wire sweep for Microchip encapsulation.

Capabilities
Moldex3D/Solid-RIM allows you to

	Predict the melt front advancement to see how the mold fills
	Predict 3D fountain flow phenomena
	Predict 3D inertia phenomena
	Predict 3D viscosity heating effects
	Predict the injection pressure and evaluate the requirement of clamping force
	Predict the conversion variation in molding process
	Predict weld line locations to minimize or eliminate them
	Predict air traps
	Identify short shot problems
	Optimize gate design to minimize weld lines and achieve balanced filling
	Optimize process conditions in filling stage, such as injection time, melt temperature, ram speed profile, curing time, etc
	Simulate filling process for multi-cavity molds or family molds

Features

	Mold filling analysis
	Melt front time prediction
	Pressure
	Temperature
	Shear stress
	Shear rate
	Velocities in X, Y, Z
	Volumetric shrinkage
	Conversion
	Density
	Melting core
	Total velocity
	Velocity vector field
	Sprue pressure variation during filling process
	Clamping force of mold in X, Y, Z directions
	Flow rate variation during filling process
	Curing analysis
	Pressure
	Temperature
	Mass flow rate
	Shear stress
	Shear rate
	Conversion
	Density
	Velocity vector
	Clamping force prediction
	Gate design evaluation
	Gate location
	Gate type
	Gate size
	Weld-lines prediction
	Air trap location prediction
	Runner design evaluation
	Runner layout
	Runner size
	Runner type
	Simulate Microchip encapsulation process
	Link to InPack to simulate wire sweep for Microchip encapsulation
	Link to InPack to simulate paddle shift for Microchip encapsulation

InPack
InPack, developed by eCAD Company, is the software dedicated for IC packaging analysis . With the seamless integration of Moldex3D/Solid-RIM and InPack, it is capable of creating high quality 3D mesh for both leadframe-type and substrate-type packages, the wire sweep and paddle shift for Microchip encapsulation process.

Key features

	Preprocessor
	The preprocessor generates the 3D solid mesh for IC package analysis. Superior mesh generation engine allows user to easily create complex Microchip encapsulation solid mesh. All model components can be supported, including EMC, chip, tape, lead frame, solder ball, air, substrate, etc.
	Analysis capability
	It is capable of simulating the wire sweep and paddle shift for Microchip ncapsulation process.
	Postprocessor
	The postprocessor provides users the graphic interface to investigate the analysis results, including mold filling analysis, wire sweep analysis and paddle shift analysis.

For more information, please contact us.